Abstract— We present an SoC testing approach that integrates test data compression, TAM/test wrapper design, and test scheduling. An improved LFSR reseeding technique is used as ...
1 High temperature has become a major problem for system-on-chip testing. In order to reduce the test time while keeping the temperature of the chip under test within a safe range,...
Zhiyuan He, Zebo Peng, Petru Eles, Paul M. Rosinge...
At-speed testing of high-speed circuits is becoming increasingly difficult with external testers due to the growing gap between design and tester performance, growing cost of high...
1 In sub-micron technology circuits high integration levels coupled with the increased sensitivity to soft errors even at ground level make the task of guaranteeing systems’ depe...
Paolo Bernardi, Leticia Maria Veiras Bolzani, Maur...