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ISPD
2003
ACM
105views Hardware» more  ISPD 2003»
14 years 1 months ago
Partition-driven standard cell thermal placement
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
Guoqiang Chen, Sachin S. Sapatnekar
TVLSI
2010
13 years 2 months ago
Discrete Buffer and Wire Sizing for Link-Based Non-Tree Clock Networks
Clock network is a vulnerable victim of variations as well as a main power consumer in many integrated circuits. Recently, link-based non-tree clock network attracts people's...
Rupak Samanta, Jiang Hu, Peng Li
CCGRID
2010
IEEE
12 years 11 months ago
WORKEM: Representing and Emulating Distributed Scientific Workflow Execution State
- Scientific workflows have become an integral part of cyberinfrastructure as their computational complexity and data sizes have grown. However, the complexity of the distributed i...
Lavanya Ramakrishnan, Dennis Gannon, Beth Plale
DAC
2008
ACM
14 years 8 months ago
Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM
In the design of complex power distribution networks (PDN) with multiple power islands, it is required that the PDN represents a low impedance as seen by the digital modules. This...
Krishna Bharath, Ege Engin, Madhavan Swaminathan
DATE
2003
IEEE
124views Hardware» more  DATE 2003»
14 years 1 months ago
Hierarchical Global Floorplacement Using Simulated Annealing and Network Flow Area Migration
– Floorplanning large designs with many hard macros and IP blocks of various sizes is becoming an increasingly important and challenging problem. This paper presents a global flo...
Wonjoon Choi, Kia Bazargan