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» Interconnect Analysis: From 3-D Structures to Circuit Models
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ICCAD
2001
IEEE
113views Hardware» more  ICCAD 2001»
14 years 4 months ago
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
TingYen Chiang, Kaustav Banerjee, Krishna Saraswat
CGI
2004
IEEE
13 years 11 months ago
From Continuous to Discrete Games
Computer games follow a scheme of continuous simulation, coupling the rendering phase and the simulation phase. That way of operation has disadvantages that can be avoided using a...
Inmaculada García, Ramón Mollá...
ICCAD
2003
IEEE
141views Hardware» more  ICCAD 2003»
14 years 4 months ago
Passive Synthesis of Compact Frequency-Dependent Interconnect Models via Quadrature Spectral Rules
In this paper, we present a reduced order inodeling methodology, based on the utilization of optimal non-uniform grids generated by Gaussian spectral rules, for the direct passive...
Traianos Yioultsis, Anne Woo, Andreas C. Cangellar...
ICIP
1997
IEEE
14 years 9 months ago
Model-Based Estimation of Facial Expression Parameters from Image Sequences
In this paper we present a model-based algorithm for the estimation of 3D motion and the analysis of facial expressions of a speaking person. A set of facial animation parameters ...
Peter Eisert, Bernd Girod
DAC
2006
ACM
14 years 8 months ago
Fast analysis of structured power grid by triangularization based structure preserving model order reduction
In this paper, a Triangularization Based Structure preserving (TBS) model order reduction is proposed to verify power integrity of on-chip structured power grid. The power grid is...
Hao Yu, Yiyu Shi, Lei He