108 search results - page 16 / 22 » Introspective 3D chips |
ISQED
2010
IEEE
14 years 2 months ago
2010
IEEE
- In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to...
FCCM
2008
IEEE
14 years 3 months ago
2008
IEEE
This paper presents a proto-type autonomous signal processing system on a chip. The system is architected such that high performance digital signal processing occurs in the FPGAâ€...
ARC
2012
Springer
12 years 4 months ago
2012
Springer
As the size of FPGA devices grows following Moore’s law, it becomes possible to put a complete manycore system onto a single FPGA chip. The centralized memory hierarchy on typica...
JETC
2008
13 years 7 months ago
2008
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
TVLSI
2010
13 years 3 months ago
2010
Hardware debuggers and logic analyzers must be able to record a continuous trace of data. Since the trace data are tremendous, to save space, these traces are often compressed. The...