108 search results - page 6 / 22 » Introspective 3D chips |
ISCA
2007
IEEE
14 years 1 months ago
2007
IEEE
Much like multi-storey buildings in densely packed metropolises, three-dimensional (3D) chip structures are envisioned as a viable solution to skyrocketing transistor densities an...
VLSID
2010
IEEE
13 years 6 months ago
2010
IEEE
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, is one of the promising solutions to mitigate the interconnect...
ASPDAC
2006
ACM
14 years 1 months ago
2006
ACM
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
ASPDAC
2009
ACM
14 years 2 months ago
2009
ACM
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
- This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of ...