4 search results - page 1 / 1 » Investigating the effects of fine-grain three-dimensional in... |
ICCD
2007
IEEE
14 years 7 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
JETC
2008
13 years 9 months ago
2008
MICRO
2008
IEEE
14 years 5 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
TCAD
2008
13 years 10 months ago
2008
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...