1295 search results - page 176 / 259 » Layered manufacturing technologies |
GLVLSI
2009
IEEE
14 years 3 months ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
- The intrinsic capability brought by each new technology node opens the way to a broad range of system integration options and continuously enables new applications to be integrat...
MIDDLEWARE
2005
Springer
14 years 2 months ago
2005
Springer
Currently, the interest in Ambient Intelligence (or AmI) has increased exponentially due to the widespread use of portable devices. Users demand more and more functionality from t...
ISPD
2004
ACM
14 years 2 months ago
2004
ACM
Modern processors and SoCs require the adoption of poweroriented design styles, due to the implications that power consumption may have on reliability, cost and manufacturability ...
SISW
2003
IEEE
14 years 2 months ago
2003
IEEE
— Smart cards are widely known for their tamper resistance, but only contain a small amount of memory. Though very small, this memory often contains highly valuable information (...