In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
- The intrinsic capability brought by each new technology node opens the way to a broad range of system integration options and continuously enables new applications to be integrat...
Maurizio Paganini, Georg Kimmich, Stephane Ducrey,...
Currently, the interest in Ambient Intelligence (or AmI) has increased exponentially due to the widespread use of portable devices. Users demand more and more functionality from t...
Modern processors and SoCs require the adoption of poweroriented design styles, due to the implications that power consumption may have on reliability, cost and manufacturability ...
— Smart cards are widely known for their tamper resistance, but only contain a small amount of memory. Though very small, this memory often contains highly valuable information (...
Michael Neve, Eric Peeters, David Samyde, Jean-Jac...