1295 search results - page 22 / 259 » Layered manufacturing technologies |
CODES
2003
IEEE
14 years 24 days ago
2003
IEEE
Future wireless internet enabled devices will be increasingly powerful supporting many more applications including one of the most crucial, security. Although SoCs offer more resi...
ISPD
2007
ACM
13 years 9 months ago
2007
ACM
When VLSI technology scales toward 45nm, the lithography wavelength stays at 193nm. This large gap results in strong refractive effects in lithography. Consequently, it is a huge...
DAC
2005
ACM
13 years 9 months ago
2005
ACM
Implementing logic blocks in an integrated circuit in terms of repeating or regular geometry patterns [6,7] can provide significant advantages in terms of manufacturability and de...
ASPDAC
2009
ACM
13 years 5 months ago
2009
ACM
We have developed a new 3-dimensional stacking technology using wafer-to-wafer stacked method and evaluated the connectivity between TSV and micro-bump. The prototype 3-layer stac...
ISCA
2007
IEEE
14 years 1 months ago
2007
IEEE
We introduce a novel chip fabrication technique called “brick and mortar”, in which chips are made from small, pre-fabricated ASIC bricks and bonded in a designer-specified a...