Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
State-of-the-art technologies in very large scale integration (VLSI) allow for the realization of gates with varying energy consumptions and hence delays (i.e., processing speeds) ...
Abstract— This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficient...
Leakage power dissipation is one of the most critical factors for the overall current dissipation and future designs. However, design techniques for the reduction of leakage power...
Recently, cooperative communication has attracted a lot of attention for its potential to increase spatial diversity. However, limited attention has been paid to the physical laye...