71 search results - page 13 / 15 » Lossless and Dissipative Distributed Systems |
NANONET
2009
Springer
14 years 3 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
HPCA
2007
IEEE
14 years 11 months ago
2007
IEEE
Chip multiprocessors with multiple simpler cores are gaining popularity because they have the potential to drive future performance gains without exacerbating the problems of powe...
ICCD
2008
IEEE
14 years 7 months ago
2008
IEEE
— Clock frequency and transistor density increases have resulted in elevated chip temperatures. In order to meet temperature constraints while still exploiting the performance op...
HPCA
2004
IEEE
14 years 11 months ago
2004
IEEE
As microprocessors become increasingly complex, the techniques used to analyze and predict their behavior must become increasingly rigorous. This paper applies wavelet analysis te...
GECCO
2009
Springer
14 years 5 months ago
2009
Springer
VLSI research, in its continuous push toward further miniaturisation, is seeking to break through the limitations of current circuit manufacture techniques by moving towards biomi...