1942 search results - page 370 / 389 » Matroids from modules |
AOSD
2007
ACM
13 years 11 months ago
2007
ACM
Most current software systems contain undocumented high-level ideas implemented across multiple files and modules. When developers perform program maintenance tasks, they often wa...
ASPDAC
2007
ACM
13 years 11 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
CODES
2007
IEEE
13 years 11 months ago
2007
IEEE
System-level and Platform-based design, along with Transaction Level modeling (TLM) techniques and languages like SystemC, appeared as a response to the ever increasing complexity...
DIM
2007
ACM
13 years 11 months ago
2007
ACM
We have implemented an identity provider (IdP), which is defined by the Liberty Alliance on a mobile phone. We propose an authentication method, which uses this personal IdP as a ...
WCNC
2010
IEEE
13 years 11 months ago
2010
IEEE
—In this paper, the mutual cooperative communication between multiple nodes in a wireless network is efficiently achieved through a novel concept of Space-Time Network Coding (S...