1222 search results - page 232 / 245 » Mistreatment-resilient distributed caching |
HPCA
2007
IEEE
14 years 8 months ago
2007
IEEE
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
HPCA
2005
IEEE
14 years 8 months ago
2005
IEEE
Long-latency loads are critical in today's processors due to the ever-increasing speed gap with memory. Not only do these loads block the execution of dependent instructions,...
HPCA
2005
IEEE
14 years 8 months ago
2005
IEEE
Simultaneous multithreading (SMT) and chip multiprocessing (CMP) both allow a chip to achieve greater throughput, but their relative energy-efficiency and thermal properties are s...
HPCA
2005
IEEE
14 years 8 months ago
2005
IEEE
Improvements in semiconductor technology now enable Chip Multiprocessors (CMPs). As many future computer systems will use one or more CMPs and support shared memory, such systems ...
HPCA
2005
IEEE
14 years 8 months ago
2005
IEEE
With the increasing concern of the security on high performance multiprocessor enterprise servers, more and more effort is being invested into defending against various kinds of a...