We present a new design environment, called System Canvas, targeted at DSP and telecommunication system designs. Our environment uses an easy-to-use block-diagram syntax to specif...
The application of AI planning techniques to manufacturing systems is being widely deployed for all the tasks involved in the process, from product design to production planning an...
It is widely recognized that device and interconnect fabrics at the nanoscale will be characterized by an increased susceptibility to transient faults. This appears to be intrinsi...
System-on-Chip (SOC) and other complex distributed hardware/software systems contain heterogeneous components such as DSPs, micro-controllers, application specific logic etc., whi...
Deepak Mathaikutty, Hiren D. Patel, Sandeep K. Shu...
Abstract—Addressing both standby and active power is a major challenge in developing System-on-Chip designs for batterypowered products. Powering off sections of logic or memorie...
Ashish Darbari, Bashir M. Al-Hashimi, David Flynn,...