Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
In this paper, we address the interconnect-driven floorplanning problem that integrates OPC-friendly bus assignment with floorplanning. Buses consist of a number of horizontal/v...
Hua Xiang, Liang Deng, Li-Da Huang, Martin D. F. W...
As VLSI technology reaches 45nm technology node, leakage power optimization has become a major design challenge. Threshold voltage (vt) assignment has been extensively studied, du...
System optimization techniques based on dynamic voltage scaling (DVS) are widely used with the aim of reducing processor energy consumption. Inter-task DVS assigns the same voltag...