56 search results - page 4 / 12 » Multilevel generalized force-directed method for circuit pla... |
DAC
2012
ACM
11 years 10 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
ASPDAC
2005
ACM
13 years 9 months ago
2005
ACM
Abstract— Regular structures are present in many types of circuits. If this structure can be identified and utilized, performance can be improved dramatically. In this paper, we...
ASPDAC
2000
ACM
14 years 19 hour ago
2000
ACM
Global placement of hypergraphs is critical in the top-down placement of large timing-driven designs 10, 16 . Placement quality is evaluated in terms of the half-perimeter wirelen...
DAC
2003
ACM
14 years 8 months ago
2003
ACM
We present in this paper a multilevel floorplanning/placement framework based on the B*-tree representation, called MB*-tree, to handle the floorplanning and packing for large-sca...
ISPD
2005
ACM
14 years 1 months ago
2005
ACM
Placement is a critical component of today's physical synthesis flow with tremendous impact on the final performance of VLSI designs. However, it accounts for a significant p...