56 search results - page 6 / 12 » Multilevel generalized force-directed method for circuit pla... |
TCAD
2008
13 years 7 months ago
2008
In this paper, we propose the first metal-density driven placement algorithm to reduce CMP variation and achieve higher routability. Based on an analytical placement framework, we...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
In this paper, we propose a new linear programming based timing driven placement framework for high performance designs. Our LP framework is mainly net-based, but it takes advanta...
ICCAD
2010
IEEE
13 years 5 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
DAC
2007
ACM
14 years 8 months ago
2007
ACM
Abstract-- In nanometer-scale VLSI technologies, several interconnect issues like routing congestion and interconnect delay have become the main concerns in placement. However, all...
FPGA
2005
ACM
14 years 1 months ago
2005
ACM
Logic duplication is an effective method for improving circuit performance. In this paper we present an algorithm named SPD that performs simultaneous placement and duplication to...