Modern integrated circuits (ICs) are becoming increasingly complex. The complexity makes it difficult to design, manufacture and integrate these high-performance ICs. The advent o...
The complexity of communication networks and the amount of information transferred in these networks have made the management of such networks increasingly difficult. Since faults ...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
The weight-decay technique is an effective approach to handle overfitting and weight fault. For fault-free networks, without an appropriate value of decay parameter, the trained ne...
Soft error due to ionizing radiation is emerging as a major concern for future technologies. The measurement unit for failures due to soft errors is called Failure-In-Time (FIT) t...