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121
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DAC
2010
ACM
15 years 6 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
152
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CASES
2003
ACM
2003
ACM
A hierarchical approach for energy efficient application design using heterogeneous embedded systems
15 years 6 months ago
Several features such as reconfiguration, voltage and frequency scaling, low-power operating states, duty-cycling, etc. are exploited for latency and energy efficient application ...
149
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VISUALIZATION
1991
IEEE
15 years 6 months ago
1991
IEEE
We describe a software system, TOPO, that numerically analyzes and graphically displays topological aspects of a three dimensional vector field, v, to produce a single, relativel...
111
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AVI
2008
15 years 4 months ago
2008
As information environments grow in complexity, we yearn for simple interfaces that streamline human cognition and effort. Users need to perform complex operations on thousands of...
136
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CCS
2008
ACM
15 years 4 months ago
2008
ACM
By functionally decomposing a specific algorithm (the hierarchical secure aggregation algorithm of Chan et al. [3] and Frikken et al. [7]), we uncover a useful general functionali...