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ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
14 years 1 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
ICCV
2011
IEEE
12 years 7 months ago
Latent Low-Rank Representation for Subspace Segmentation and Feature Extraction
Low-Rank Representation (LRR) [16, 17] is an effective method for exploring the multiple subspace structures of data. Usually, the observed data matrix itself is chosen as the dic...
Guangcan Liu, Shuicheng Yan
GLOBECOM
2008
IEEE
14 years 2 months ago
Delay-Energy Tradeoffs in Wireless Ad-Hoc Networks with Partial Channel State Information
Given a wireless network where each link undergoes small-scale (Rayleigh) fading, we consider the problem of routing a message from a source node to a target node while minimizing...
Matthew Brand, Andreas F. Molisch
ICCAD
1994
IEEE
117views Hardware» more  ICCAD 1994»
13 years 12 months ago
Optimization of critical paths in circuits with level-sensitive latches
A simple extension of the critical path method is presented which allows more accurate optimization of circuits with level-sensitive latches. The extended formulation provides a s...
Timothy M. Burks, Karem A. Sakallah
DAC
2002
ACM
14 years 8 months ago
Towards global routing with RLC crosstalk constraints
Conventional global routing minimizes total wire length and congestion. Experiments using large industrial benchmark circuits show that up to 24% of nets in such routing solutions...
James D. Z. Ma, Lei He