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CGF
2011
12 years 11 months ago
2011
We present a novel method to estimate an approximation of the reflectance characteristics of optically thick, homogeneous translucent materials using only a single photograph as ...
CHI
2007
ACM
14 years 8 months ago
2007
ACM
We present ExperiScope, an analytical tool to help designers and experimenters explore the results of quantitative evaluations of interaction techniques. ExperiScope combines a ne...
MICRO
2003
IEEE
14 years 1 months ago
2003
IEEE
With increasing clock frequencies and silicon integration, power aware computing has become a critical concern in the design of embedded processors and systems-on-chip. One of the...
DAC
2010
ACM
13 years 11 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
ATAL
2007
Springer
14 years 1 months ago
2007
Springer
Reinforcement learning promises a generic method for adapting agents to arbitrary tasks in arbitrary stochastic environments, but applying it to new real-world problems remains di...