Abstract: This paper presents a new statistical methodology to simulate the effect of both inter-die and intra-die variation on the electrical performance of analog integrated circ...
Carlo Guardiani, Sharad Saxena, Patrick McNamara, ...
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
—Integrated circuit process technology is entering the ultra deep submicron era. At this level, interconnect structure becomes very stiff and the metal resistance shielding effec...
Efficient system-level design is increasingly relying on hierarchical design-space exploration, as well as compositional methods, to shorten time-to-market, leverage design re-use...
This paper presents a novel number system based on signed continuous valued digits. Arithmetic operations in this number system are performed using simple analog circuitry, in con...