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DAC
2000
ACM
13 years 12 months ago
An asymptotically constant, linearly bounded methodology for the statistical simulation of analog circuits including component m
Abstract: This paper presents a new statistical methodology to simulate the effect of both inter-die and intra-die variation on the electrical performance of analog integrated circ...
Carlo Guardiani, Sharad Saxena, Patrick McNamara, ...
DAC
2011
ACM
12 years 7 months ago
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
DATE
2010
IEEE
123views Hardware» more  DATE 2010»
14 years 21 days ago
Interconnect delay and slew metrics using the beta distribution
—Integrated circuit process technology is entering the ultra deep submicron era. At this level, interconnect structure becomes very stiff and the metal resistance shielding effec...
Jun-Kuei Zeng, Chung-Ping Chen
DAC
2009
ACM
14 years 8 months ago
Contract-based system-level composition of analog circuits
Efficient system-level design is increasingly relying on hierarchical design-space exploration, as well as compositional methods, to shorten time-to-market, leverage design re-use...
Xuening Sun, Pierluigi Nuzzo, Chang-Ching Wu, Albe...
TC
2002
13 years 7 months ago
A Number System with Continuous Valued Digits and Modulo Arithmetic
This paper presents a novel number system based on signed continuous valued digits. Arithmetic operations in this number system are performed using simple analog circuitry, in con...
Aryan Saed, Majid Ahmadi, Graham A. Jullien