1272 search results - page 213 / 255 » Optimizing layered middleware |
ISQED
2010
IEEE
14 years 2 months ago
2010
IEEE
—Double patterning lithography (DPL) provides an attractive alternative or a supplementary method to enable the 32nm and 22nm process nodes, relative to costlier technology optio...
ASPDAC
2009
ACM
14 years 2 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
BROADNETS
2007
IEEE
14 years 1 months ago
2007
IEEE
— Network dimensioning for wavelength-routed WDM networks has been extensively studied to maximize connection acceptance rate while minimizing the total cost. However, Internet s...
HPDC
2007
IEEE
14 years 1 months ago
2007
IEEE
Adapting to the network is the key to achieving high performance for communication-intensive applications, including scientific computing, data intensive computing, and multicast...
VTC
2007
IEEE
14 years 1 months ago
2007
IEEE
— Hydra is a flexible wireless network testbed being developed at UT Austin. Our focus is networks that support multiple wireless hops and where the network, especially the MAC,...