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ISCA
2005
IEEE
105views Hardware» more  ISCA 2005»
14 years 1 months ago
Exploiting Structural Duplication for Lifetime Reliability Enhancement
Increased power densities (and resultant temperatures) and other effects of device scaling are predicted to cause significant lifetime reliability problems in the near future. In...
Jayanth Srinivasan, Sarita V. Adve, Pradip Bose, J...
ICEB
2004
234views Business» more  ICEB 2004»
13 years 9 months ago
A Component-based Framework for Distributed Business Simulations in E-Business Environments
Simulations preserve the knowledge of complex dynamic systems and consequently transfer the knowledge of the cohesions of its elements to a specified target group. As the progress...
Alexander Hampel, Edward Bernroider
SIGMETRICS
2002
ACM
13 years 7 months ago
Full-system timing-first simulation
Computer system designers often evaluate future design alternatives with detailed simulators that strive for functional fidelity (to execute relevant workloads) and performance fi...
Carl J. Mauer, Mark D. Hill, David A. Wood
ICCAD
2009
IEEE
171views Hardware» more  ICCAD 2009»
13 years 5 months ago
A hybrid local-global approach for multi-core thermal management
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
Ramkumar Jayaseelan, Tulika Mitra
HPCA
2003
IEEE
14 years 8 months ago
Control Techniques to Eliminate Voltage Emergencies in High Performance Processors
Increasing focus on power dissipation issues in current microprocessors has led to a host of proposals for clock gating and other power-saving techniques. While generally effectiv...
Russ Joseph, David Brooks, Margaret Martonosi