101 search results - page 3 / 21 » Power Performance Thermal Design-Space Exploration for Multi... |
ISQED
2006
IEEE
14 years 1 months ago
2006
IEEE
As transistor counts keep increasing and clock frequencies rise, high power consumption is becoming one of the most important obstacles, preventing further scaling and performance...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
ASPDAC
2008
ACM
13 years 9 months ago
2008
ACM
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
HPCA
2005
IEEE
14 years 1 months ago
2005
IEEE
As microprocessors become increasingly interconnected, the power consumed by the interconnection network can no longer be ignored. Moreover, with demand for link bandwidth increas...
ASAP
2008
IEEE
14 years 2 months ago
2008
IEEE
Cooperative MIMO is a new technique that allows disjoint wireless communication nodes (e.g. wireless sensors) to form a virtual antenna array to increase bandwidth, reliability an...