101 search results - page 7 / 21 » Power Performance Thermal Design-Space Exploration for Multi... |
ASPLOS
2010
ACM
14 years 2 months ago
2010
ACM
Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate therm...
ICCD
2007
IEEE
14 years 4 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
ICCD
2008
IEEE
14 years 4 months ago
2008
IEEE
— Clock frequency and transistor density increases have resulted in elevated chip temperatures. In order to meet temperature constraints while still exploiting the performance op...
SBACPAD
2008
IEEE
14 years 2 months ago
2008
IEEE
Transactional memory is emerging as a parallel programming paradigm for multi-core processors. Despite the recent interest in transactional memory, there has been no study to char...
MICRO
2003
IEEE
14 years 27 days ago
2003
IEEE
This paper proposes and evaluates single-ISA heterogeneous multi-core architectures as a mechanism to reduce processor power dissipation. Our design incorporates heterogeneous cor...