3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
We consider the symmetric Gaussian interference channel where two users try to enhance their secrecy rates in a cooperative manner. Artificial noise is introduced along with useful...
: This paper proposes a pipelined, systolic architecture for two- dimensional discrete Fourier transform computation which is highly concurrent. The architecture consists of two, o...
Weakly relational numeric domains express restricted classes of linear inequalities that strike a balance between what can be described and what can be efficiently computed. Popula...
Portable embedded systems are being driven by consumer demands to be thermally efficient, perform faster, and have longer battery life. To design such a system, various hardware un...