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MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
15 years 10 months ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
CORR
2010
Springer
80views Education» more  CORR 2010»
15 years 4 months ago
Cooperative Secret Communication with Artificial Noise in Symmetric Interference Channel
We consider the symmetric Gaussian interference channel where two users try to enhance their secrecy rates in a cooperative manner. Artificial noise is introduced along with useful...
Jingge Zhu, Jianhua Mo, Meixia Tao
IAJIT
2010
107views more  IAJIT 2010»
15 years 3 months ago
Low Latency, High Throughput, and Less Complex VLSI Architecture for 2D-DFT
: This paper proposes a pipelined, systolic architecture for two- dimensional discrete Fourier transform computation which is highly concurrent. The architecture consists of two, o...
Sohil Shah, Preethi Venkatesan, Deepa Sundar, Muni...
ATVA
2009
Springer
158views Hardware» more  ATVA 2009»
15 years 11 months ago
Logahedra: A New Weakly Relational Domain
Weakly relational numeric domains express restricted classes of linear inequalities that strike a balance between what can be described and what can be efficiently computed. Popula...
Jacob M. Howe, Andy King
GECCO
2004
Springer
148views Optimization» more  GECCO 2004»
15 years 10 months ago
A Multi-objective Approach to Configuring Embedded System Architectures
Portable embedded systems are being driven by consumer demands to be thermally efficient, perform faster, and have longer battery life. To design such a system, various hardware un...
James Northern III, Michael A. Shanblatt