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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
13 years 12 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
ASPDAC
2007
ACM
98views Hardware» more  ASPDAC 2007»
13 years 12 months ago
Node Mergers in the Presence of Don't Cares
Abstract-- SAT sweeping is the process of merging two or more functionally equivalent nodes in a circuit by selecting one of them to represent all the other equivalent nodes. This ...
Stephen Plaza, Kai-Hui Chang, Igor L. Markov, Vale...
ASPDAC
2007
ACM
131views Hardware» more  ASPDAC 2007»
13 years 12 months ago
Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign
Deep submicron effects drive the complication in designing chips, as well as in package designs and communications between package and board. As a result, the iterative interface d...
Ren-Jie Lee, Ming-Fang Lai, Hung-Ming Chen
DATE
2009
IEEE
155views Hardware» more  DATE 2009»
13 years 12 months ago
Automatically mapping applications to a self-reconfiguring platform
The inherent reconfigurability of SRAM-based FPGAs enables the use of configurations optimized for the problem at hand. Optimized configurations are smaller and faster than their g...
Karel Bruneel, Fatma Abouelella, Dirk Stroobandt
GLOBECOM
2009
IEEE
13 years 12 months ago
Energy-Efficient Multi-Pipeline Architecture for Terabit Packet Classification
Energy efficiency has become a critical concern in designing high speed packet classification engines for next generation routers. Although TCAM-based solutions can provide high th...
Weirong Jiang, Viktor K. Prasanna