9 search results - page 1 / 2 » Practical iterated fill synthesis for CMP uniformity |
DAC
2000
ACM
15 years 5 days ago
2000
ACM
We propose practical iterated methods for layout density control for CMP uniformity, based on linear programming, Monte-Carlo and greedy algorithms. We experimentally study the tr...
TCAD
2002
13 years 10 months ago
2002
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
TCAD
2008
13 years 11 months ago
2008
We survey recent research and practice in the area of chemical
DAC
2009
ACM
15 years 6 days ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
DAC
2003
ACM
15 years 5 days ago
2003
ACM
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local ...