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MICRO
2009
IEEE
14 years 2 months ago
2009
IEEE
3D-integration is a promising technology to help combat the “Memory Wall” in future multi-core processors. Past work has considered using 3D-stacked DRAM as a large last-level...
SDM
2010
SIAM
13 years 9 months ago
2010
SIAM
Many applications involve a set of prediction tasks that must be accomplished sequentially through user interaction. If the tasks are interdependent, the order in which they are p...
GLVLSI
2009
IEEE
14 years 2 months ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
CLUSTER
2003
IEEE
14 years 27 days ago
2003
IEEE
In this paper we analyze the I/O access patterns of a widely-used biological sequence search tool and implement two variations that employ parallel-I/O for data access based on PV...
DAC
2002
ACM
14 years 8 months ago
2002
ACM
The design of high-throughput large-state Viterbi decoders relies on the use of multiple arithmetic units. The global communication channels among these parallel processors often ...