Cache memories are commonly implemented through multiple memory banks to improve bandwidth and latency. The early knowledge of the data cache bank that an instruction will access ...
Stefan Bieschewski, Joan-Manuel Parcerisa, Antonio...
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
We introduce a dynamic battery model that describes the variations of the capacity of a battery under time varying discharge current. This model supports a co-design approach for ...
Fetching instructions from a set-associative cache in an embedded processor can consume a large amount of energy due to the tag checks performed. Recent proposals to address this ...
Timothy M. Jones, Sandro Bartolini, Bruno De Bus, ...
One of the security issues in embedded system is the ability of an adversary to perform side channel attacks. Power analysis attacks are often very successful, where the power seq...
Jude Angelo Ambrose, Roshan G. Ragel, Sri Paramesw...