In this paper, we present a reduced order inodeling methodology, based on the utilization of optimal non-uniform grids generated by Gaussian spectral rules, for the direct passive...
Traianos Yioultsis, Anne Woo, Andreas C. Cangellar...
Interconnect architecture plays an important role in determining the throughput of meshed communication structures. We assume a mesh structure with uniform communication demand fo...
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
Alberto Fazzi, L. Magagni, Mario de Dominicis, Pao...
The improved T and improved n models are proposed for onchip interconnect macromodeling. Using global approximations, simple approximation frames are derived and applied to modeli...
We present a system for creating and manipulating layered procedural surface editing operations, which is motivated by the limited support for iterative design in free-form modeli...