378 search results - page 52 / 76 » Processor Modeling for Hardware Software Codesign |
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
CODES
2006
IEEE
14 years 25 days ago
2006
IEEE
For modern embedded systems, the complexity of embedded applications has reached a point where the performance requirements of these applications can no longer be supported by emb...
CODES
2005
IEEE
14 years 12 days ago
2005
IEEE
The continuous improvement on the design methodologies and processes has made possible the creation of huge and very complex digital systems. Design verification is one of the mai...
CODES
2003
IEEE
14 years 2 days ago
2003
IEEE
One of the most challenging problems in high-level synthesis is how to quickly explore a wide range of design options to achieve high-quality designs. This paper presents an Integ...
DAC
2006
ACM
14 years 7 months ago
2006
ACM
ing models and HW-SW Interfaces Abstraction for Multi-Processor SoC Ahmed A. Jerraya TIMA Laboratory 46 Ave Felix Viallet 38031 Grenoble CEDEX, France +33476574759 Ahmed.Jerraya@im...