Interconnection networks have been deployed as the communication fabric in a wide range of parallel computer systems. With recent technological trends allowing growing quantities ...
High-level power design presents a complex, multiobjective problem that involves the simultaneous optimisation of competing criteria such as speed, area and power. It is difficult...
Accurate modeling of delay, power, and area of interconnections early in the design phase is crucial for effective system-level optimization. Models presently used in system-level...
Luca P. Carloni, Andrew B. Kahng, Swamy Muddu, Ale...
Interconnection networks in Systems-On-Chip begin to have a non-negligible impact on the power consumption of a whole system. This is because of increasing inter-wire capacitances...
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...