214 search results - page 13 / 43 » Quasi-Resonant Interconnects: A Low Power Design Methodology |
VLSID
2006
IEEE
14 years 8 months ago
2006
IEEE
SoC design methodologies are under constant revision due to adoption of fast shrinking process technologies at nanometer levels. Nanometer process geometries exhibit new complex d...
SLIP
2004
ACM
14 years 1 months ago
2004
ACM
Throughput, power consumption, signal integrity, pin count and routing complexity are all increasingly important interconnect issues that the system designer must deal with. Recen...
HOTI
2008
IEEE
14 years 2 months ago
2008
IEEE
Several types of low power passive equalizer is proposed and optimized in this work. The equalizer topologies include T-junction, parallel R-C and series R-L structures. These str...
ISLPED
2003
ACM
14 years 1 months ago
2003
ACM
Power will be the key limiter to system scalability as interconnection networks take up an increasingly significant portion of system power. In this paper, we propose an architec...
ISVLSI
2003
IEEE
14 years 1 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...