Ever increasing complexity and heterogeneity of SoC platforms require diversified on-chip communication schemes beyond the currently omnipresent shared bus architectures. To prev...
Tim Kogel, Malte Doerper, Andreas Wieferink, Raine...
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
In this paper, we propose a novel statistical model order reduction technique, called statistical spectrum model order reduction (SSMOR) method, which considers both intra-die and...
Jeffrey Fan, Ning Mi, Sheldon X.-D. Tan, Yici Cai,...
How does multilevel metalization impact the design of FPGA interconnect? The availability of a growing number of metal layers presents the opportunity to use wiring in the thirddi...
Artificial neural networks, electronic circuits, and gene networks are some examples of systems that can be modeled as networks, that is, as collections of interconnected nodes. I...
Mattiussi, Claudio, Dürr, Peter, Marbach, Daniel ...