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DSD
2003
IEEE
121views Hardware» more  DSD 2003»
14 years 1 months ago
CCC: Crossbar Connected Caches for Reducing Energy Consumption of On-Chip Multiprocessors
With shrinking feature size of silicon fabrication technology, architects are putting more and more logic into a single die. While one might opt to use these transistors for build...
Lin Li, Narayanan Vijaykrishnan, Mahmut T. Kandemi...
HOTI
2008
IEEE
14 years 3 months ago
Design Exploration of Optical Interconnection Networks for Chip Multiprocessors
The Network-on-Chip (NoC) paradigm has emerged as a promising solution for providing connectivity among the increasing number of cores that get integrated into both systems-onchip...
Michele Petracca, Benjamin G. Lee, Keren Bergman, ...
TACO
2010
75views more  TACO 2010»
13 years 7 months ago
An analysis of on-chip interconnection networks for large-scale chip multiprocessors
Daniel Sanchez, George Michelogiannakis, Christos ...
3DIC
2009
IEEE
263views Hardware» more  3DIC 2009»
13 years 12 months ago
3D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC)
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
Yaoyao Ye, Lian Duan, Jiang Xu, Jin Ouyang, Mo Kwa...
DAC
2010
ACM
14 years 15 days ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...