12 search results - page 1 / 3 » Reliability aware through silicon via planning for 3D stacke... |
DATE
2009
IEEE
14 years 5 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
SLIP
2009
ACM
14 years 5 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
ICCAD
2009
IEEE
13 years 8 months ago
2009
IEEE
GLVLSI
2009
IEEE
13 years 8 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
DATE
2009
IEEE
14 years 5 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...