Sciweavers

282 search results - page 14 / 57
» Reliability- and process-variation aware design of integrate...
Sort
View
DAC
2005
ACM
14 years 10 months ago
Temperature-aware resource allocation and binding in high-level synthesis
Physical phenomena such as temperature have an increasingly important role in performance and reliability of modern process technologies. This trend will only strengthen with futu...
Rajarshi Mukherjee, Seda Ogrenci Memik, Gokhan Mem...
DAC
2006
ACM
14 years 3 months ago
Design in reliability for communication designs
Silicon design implementation has become increasingly complex with the deep submicron technologies such as 90nm and below. It is common to see multiple processor cores, several ty...
Uday Reddy Bandi, Murty Dasaka, Pavan K. Kumar
SLIP
2009
ACM
14 years 3 months ago
From 3D circuit technologies and data structures to interconnect prediction
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
Robert Fischbach, Jens Lienig, Tilo Meister
ICCD
2005
IEEE
124views Hardware» more  ICCD 2005»
14 years 6 months ago
A Thermally-Aware Methodology for Design-Specific Optimization of Supply and Threshold Voltages in Nanometer Scale ICs
As CMOS technology scales deeper into the nanometer regime, factors such as leakage power and chip temperature emerge as critically important concerns for VLSI design. This paper,...
Sheng-Chih Lin, Navin Srivastava, Kaustav Banerjee
ASPDAC
1998
ACM
97views Hardware» more  ASPDAC 1998»
14 years 1 months ago
A Novel Design Assistant for Analog Circuits
 This paper presents a new design assistant for analog integrated circuits. The interactive tool is implemented in the Design Framework II of Cadence and supports the designer d...
Markus Wolf, Ulrich Kleine, Frédéric...