282 search results - page 30 / 57 » Reliability- and process-variation aware design of integrate... |
ISQED
2007
IEEE
14 years 3 months ago
2007
IEEE
With its advantages in wirelength reduction and routing flexibility compared with Manhattan routing, X-architecture has been proposed and applied to modern IC design. As a critic...
DAC
2012
ACM
11 years 11 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
ICCAD
2009
IEEE
13 years 6 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
ISPD
2006
ACM
14 years 3 months ago
2006
ACM
The existing decoupling capacitance optimization approaches meet constraints on input impedance for package. In this paper, we show that using impedance as constraints leads to la...
ICCAD
1998
IEEE
14 years 1 months ago
1998
IEEE
Noise can cause digital circuits to switch incorrectly and thus produce spurious results. Noise can also have adverse power, timing and reliability e ects. Dynamic logic is partic...