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DAC
2003
ACM
14 years 10 months ago
Random walks in a supply network
This paper presents a power grid analyzer based on a random walk technique. A linear-time algorithm is first demonstrated for DC analysis, and is then extended to perform transien...
Haifeng Qian, Sani R. Nassif, Sachin S. Sapatnekar
DAC
2012
ACM
11 years 11 months ago
Exploiting die-to-die thermal coupling in 3D IC placement
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim
DATE
2010
IEEE
162views Hardware» more  DATE 2010»
14 years 2 months ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
DAC
2008
ACM
14 years 10 months ago
Scan chain clustering for test power reduction
An effective technique to save power during scan based test is to switch off unused scan chains. The results obtained with this method strongly depend on the mapping of scan flip-...
Christian G. Zoellin, Hans-Joachim Wunderlich, Jen...
DAC
2009
ACM
14 years 10 months ago
Nanoscale digital computation through percolation
In this study, we apply a novel synthesis technique for implementing robust digital computation in nanoscale lattices with random interconnects: percolation theory on random graph...
Mustafa Altun, Marc D. Riedel, Claudia Neuhauser