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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
13 years 11 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
NSDI
2008
13 years 9 months ago
UsenetDHT: A Low-Overhead Design for Usenet
Usenet is a popular distributed messaging and file sharing service: servers in Usenet flood articles over an overlay network to fully replicate articles across all servers. Howeve...
Emil Sit, Robert Morris, M. Frans Kaashoek
DAC
2008
ACM
13 years 9 months ago
Application mapping for chip multiprocessors
The problem attacked in this paper is one of automatically mapping an application onto a Network-on-Chip (NoC) based chip multiprocessor (CMP) architecture in a locality-aware fas...
Guangyu Chen, Feihui Li, Seung Woo Son, Mahmut T. ...
CSREASAM
2006
13 years 8 months ago
Reinforcing Access Control Using Fuzzy Relation Equations
Current computer security systems are based on the premise that once a user presents valid credentials to the authentication system (e.g. valid ID and password), they are granted ...
Ali Berrached, André de Korvin
MASCOTS
2003
13 years 8 months ago
Minimizing Packet Loss by Optimizing OSPF Weights Using Online Simulation
In this paper, we present a scheme for minimizing packet loss in OSPF networks by optimizing link weights using Online Simulation. We have chosen packet loss rate in the network a...
Hema Tahilramani Kaur, Tao Ye, Shivkumar Kalyanara...