— As technology scales, the delay uncertainty caused by process variations has become increasingly pronounced in deep submicron designs. In the presence of process variations, wo...
Increasing power densities and the high cost of low thermal resistance packages and cooling solutions make it impractical to design processors for worst-case temperature scenarios...
Thidapat Chantem, Xiaobo Sharon Hu, Robert P. Dick
The present paper is part of a larger effort to redesign, from the ground up, the best possible interconnect topologies for switchless multiprocessor computer systems. We focus he...
As semiconductor processing technology continues to scale down, managing reliability becomes an increasingly difficult challenge in high-performance microprocessor design. Transie...
Single-electron devices have drawn much attention in the last two decades. They have been widely used for device research and also show promise as a potential alternative to compl...