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184
Voted
IPPS
2006
IEEE
15 years 9 months ago
2006
IEEE
The incorporation of last-generation sensors to airborne and satellite platforms is currently producing a nearly continual stream of high-dimensional data, and this explosion in t...
121
Voted
ISCA
2006
IEEE
15 years 9 months ago
2006
IEEE
Microprocessor design is undergoing a major paradigm shift towards multi-core designs, in anticipation that future performance gains will come from exploiting threadlevel parallel...
122
Voted
MICRO
2006
IEEE
15 years 9 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
137
Voted
SRDS
2006
IEEE
15 years 9 months ago
2006
IEEE
Failure models characterise the expected component failures in fault-tolerant computing. In the context of distributed systems, a failure model usually consists of two parts: a fu...
126
Voted
ASPLOS
2006
ACM
15 years 9 months ago
2006
ACM
While the number of transistors on a chip increases exponentially over time, the productivity that can be realized from these systems has not kept pace. To deal with the complexit...