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ISCA
2003
IEEE
168views Hardware» more  ISCA 2003»
13 years 12 months ago
Temperature-Aware Microarchitecture
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
MJ
2011
288views Multimedia» more  MJ 2011»
13 years 1 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
DATE
2007
IEEE
85views Hardware» more  DATE 2007»
14 years 1 months ago
Impact of process variations on multicore performance symmetry
Multi-core architectures introduce a new granularity at which process variations may occur, yielding asymmetry among cores that were designed—and that software expects—to be s...
Eric Humenay, David Tarjan, Kevin Skadron
ICCAD
2010
IEEE
145views Hardware» more  ICCAD 2010»
13 years 4 months ago
Fuzzy control for enforcing energy efficiency in high-performance 3D systems
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
WICSA
2004
13 years 8 months ago
Software Reconfiguration Patterns for Dynamic Evolution of Software Architectures
A software reconfiguration pattern is a solution to a problem in component-based software systems where the configuration needs to be updated while the system is operational. It d...
Hassan Gomaa, Mohamed Hussein