This paper investigates under which conditions information can be reliably shared and consensus can be solved in unknown and anonymous message-passing networks that suffer from cr...
Abstract - This paper describes a communicationcentric design methodology that addresses the fundamental challenges induced by the emergence of truly heterogeneous Systems-on-Chip ...
Radu Marculescu, Diana Marculescu, Larry T. Pilegg...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
Emerging VLSI technologies and platforms are giving rise to systems with inherently high potential for runtime failure. Such failures range from intermittent electrical and mechan...