9974 search results - page 4 / 1995 » Software Interconnection Models |
114
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DFT
2007
IEEE
15 years 10 months ago
2007
IEEE
During semiconductor manufacturing, particles undesirably depose on the surface of the wafer causing “open” and “short” defects to interconnects. In this paper, a third ty...
156
Voted
CODES
2003
IEEE
15 years 9 months ago
2003
IEEE
Ever increasing complexity and heterogeneity of SoC platforms require diversified on-chip communication schemes beyond the currently omnipresent shared bus architectures. To prev...
DATE
2009
IEEE
15 years 10 months ago
2009
IEEE
Abstract—This paper presents an accurate interconnect thermal model for analyzing the temperature distribution of an on-chip interconnect wire. The model addresses the ambient te...
120
Voted
ICSE
1999
IEEE-ACM
15 years 7 months ago
1999
IEEE-ACM
Software architectures promote development focused on modular building blocks and their interconnections. Since architecture-level components often contain complex functionality, ...
121
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CODES
2007
IEEE
15 years 10 months ago
2007
IEEE
Early embedded SW development with transaction-level models has been broadly promoted to improve SoC design productivity. But the proposed APIs only provide low-level read/write o...