871 search results - page 79 / 175 » Streaming Reduction Circuit |
ICCAD
2009
IEEE
13 years 8 months ago
2009
IEEE
With increasing process variation, binning has become an important technique to improve the values of fabricated chips, especially in high performance microprocessors where transpa...
DAC
2006
ACM
14 years 11 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
MICRO
2010
IEEE
13 years 8 months ago
2010
IEEE
As the number of cores on a single chip increases with more recent technologies, a packet-switched on-chip interconnection network has become a de facto communication paradigm for ...
ASPDAC
2011
ACM
13 years 2 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
INFOCOM
2000
IEEE
14 years 2 months ago
2000
IEEE
—In a reconfigurable network, lightpath connections can be dynamically changed to reflect changes in traffic conditions. This paper characterizes the gain in traffic capacity tha...