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» Synthesis of networks on chips for 3D systems on chips
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DATE
2009
IEEE
155views Hardware» more  DATE 2009»
14 years 2 months ago
Dynamic thermal management in 3D multicore architectures
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
Ayse Kivilcim Coskun, José L. Ayala, David ...
DAC
2010
ACM
13 years 11 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
AHS
2006
IEEE
124views Hardware» more  AHS 2006»
14 years 1 months ago
A Generic On-Chip Debugger for Wireless Sensor Networks
— This invited paper overviews the low level debug support hardware required for an on-chip predeployment debugging system for sensor networks. The solution provides significant...
Andrew B. T. Hopkins, Klaus D. McDonald-Maier
ISCA
2008
IEEE
188views Hardware» more  ISCA 2008»
14 years 1 months ago
MIRA: A Multi-layered On-Chip Interconnect Router Architecture
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...
Dongkook Park, Soumya Eachempati, Reetuparna Das, ...
DAC
2001
ACM
14 years 8 months ago
Latency-Driven Design of Multi-Purpose Systems-On-Chip
Milenko Drinic UCLA Computer Science Dep. 4732 Boelter Hall Los Angeles, CA 90095-1596 milenko@cs.ucla.edu Darko Kirovski Microsoft Research One Microsoft Way Redmond, WA 98052 da...
Seapahn Meguerdichian, Milenko Drinic, Darko Kirov...