18 search results - page 1 / 4 » TSIC: Thermal Scheduling Simulator for Chip Multiprocessors |
PCI
2005
Springer
14 years 2 months ago
2005
Springer
Abstract. Increased power density, hot-spots, and temperature gradients are severe limiting factors for today’s state-of-the-art microprocessors. However, the flexibility offer...
TCAD
2008
13 years 8 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
—Dynamic Thermal Management techniques have been widely accepted as a thermal solution for their low cost and simplicity. The techniques have been used to manage the heat dissipa...
CODES
2007
IEEE
14 years 2 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ISQED
2010
IEEE
14 years 1 months ago
2010
IEEE
- In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to...