162 search results - page 29 / 33 » Temperature Variable Supply Voltage for Power Reduction |
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ICCAD
2008
IEEE
14 years 4 months ago
2008
IEEE
– Due to reduction in device feature size and supply voltage, the sensitivity of digital systems to transient faults is increasing dramatically. As technology scales further, the...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
Decap (decoupling capacitor) is an effective technique for suppressing power supply noise. Nevertheless, over-usage of decap usually causes excessive power dissipation. Therefore...
DATE
2010
IEEE
14 years 15 days ago
2010
IEEE
- Electronic systems for safety-critical automotive applications must operate for many years in harsh environments. Reliability issues are worsening with device scaling down, while...
APCCAS
2002
IEEE
14 years 11 days ago
2002
IEEE
This paper presents a 10-bit pipeline ADC using double sampling technique to achieve a conversion rate of 40 MS/s at 2.5-V supply. The opamps are two-stage with folded-cascode as ...